“Amaoe Mbga-B8 BGA Reballing Platform for Android CPU SM7250 7350 6150 MSM8952 8909 MT6761 6762 6765 Glue Removing” has been added to your cart. View cart
Amaoe Mbga-B14 BGA Reballing Stencil tin planting table For Samsung Exynos CPU removal glue positioning plate CPU steel mesh
₹3,399.00
Amaoe Mbga-B14 BGA Reballing Stencil tin planting table For Samsung Exynos CPU removal glue positioning plate CPU steel mesh
Categories: New Arrival, Stencil
Description
Amaoe Mbga-B14 BGA Reballing Stencil tin planting table For Samsung Exynos CPU removal glue positioning plate CPU steel mesh
Shipping & Delivery